Xilinx Virtex® UltraScale+™ devices provide the highest performance and integration capabilities in a 14nm/16nm FinFET node. Xilinx 3rd generation 3D ICs use stacked silicon interconnect (SSI) technology to break through the limitations of Moore’s law and deliver the highest signal processing and serial I/O bandwidth to satisfy the most demanding design requirements. It also provides registered inter-die routing lines enabling >600 MHz operation, with abundant and flexible clocking to deliver a virtual monolithic design experience.

As the industry's most capable FPGA family, the devices are ideal for compute-intensive applications ranging from 1+Tb/s networking, machine learning, to radar/early-warning systems.

Key Features and Benefits

3D-on-3D Integration

FinFET with 3D IC for breakthrough density, bandwidth, and massive inter-die connectivity for virtual monolithic design

Enhanced DSP Cores

Up to 38 TOPs (22 TeraMACs) of DSP compute performance are optimized for fixed and floating point compute including INT8 for AI inference

32.75Gb/s Transceivers

Up to 128 transceivers on a device – backplane, chip-to-optics, and chip-to-chip capable

Integrated Block for PCI Express

Gen3 x16 Integrated PCIe® block for 100G applications

Memory

DDR4 support of up to 2,666Mb/s, up to 500Mb of on-chip memory caches for increased efficiency and low latency

ASIC-Class Networking IP

150G Interlaken, 100G Ethernet MAC cores for high speed connectivity

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